1. High positioning accuracy model, combined with AOI search function, compensates for XY displacement error
2. Equipped with metallographic objective lenses, 5X, 10X, 20X, 50X, 100X
3. Micro Z-axis height measurement
4. Suitable for measuring IC solder balls and gold wires
5. Z-axis repeatability ±0.5um (500X)
6. High precision and fast measurement speed; for example: an IC carrier board is 68pcs, and the measurement time is 10-14 minutes
VM5000H high-precision automatic image measurement
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product description
Features
product specification
video introduction
Industrial applications:
IC bonding gold ball and gold wire height and thickness measurement
Fully automatic measurement of IC carrier boards
Dimensional measurement of LED mounting on lead frame
Fully automatic measurement applications for various micro structures
Product advantages:
High-speed autofocus automatically measures size without the need for human judgment
Equipped with AOI identification function, the workpiece deflection error can automatically search for the measurement position
The fully automatic image measurement process is uninterrupted and the work continues to be completed.
Optical module
Using OLYMPUS fully electric optical module and objective lens
The maximum total optical coverage rate can reach 1000X
The minimum resolution can reach 0.37um
IC BONDING gold ball thickness measurement method:
rightJiao gotPadThe coordinates of the focal plane and the coordinates of the focal plane of the spherical top, and the combined distance of the two points are constructed to obtain the data of the thickness of the sphere.
IC BONDING gold wire arc height measurement method:
getPadfocal plane coordinatesandtop focusSurface coordinates, the two are constructed into a ballthickness
use50x objective lensalongsingle line segmentFind the highest point and focus
Excellent measurement performance has been adopted by many domestic packaging and testing manufacturers
